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A world leader in Automatic Balancing and process control solutions for grinding machines, the SBS Balance system improves part quality and throughput with minimal effort.

The “W-GM” edge grinder series processes various kinds of materials such as Silicon, sapphire and SiC. Our W-GM series is highly rated among manufacturers and draws attention as a solution to the yield loss associated with traditional wafer cutting.

Rugged measurement tools that help you control your GD&T requirements to make the best parts possible.

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